We are seeking a Space Electronics Packaging Engineer to join our rapidly growing high-performance team. Our division is a subset of the company, comprised of engineers of various disciplines organized into product development teams. This atmosphere provides the perfect opportunity to demonstrate your expertise on the most challenging problems while also expanding your skills and advancing your career.
We are looking for a highly motivated engineer who enjoys a challenging and dynamic environment. You will be working with a team of talented engineers across systems mechanical, manufacturing, electrical and RF disciplines to design and develop packaging solutions for next-generation RF payloads for satellites. Multiple opportunities will allow you to contribute from conceptual design through detailed design, fabrication, testing, and ultimately launch of your design.
-Focus on design, analysis, design for reliability, design for manufacturability of electronic systems from hybrid modules through chassis level systems.
-Design ruggedized electronics assemblies, enclosures, and chassis for space systems and military applications utilizing Solidworks.
-Optimize thermal performance, structural performance, material compatibility, and reliability utilizing engineering analysis and optimization techniques.
-Review electronics packaging designs as they progress through development, qualification, and production considering design for manufacturability, yield issues, and reliability.
-Develop engineering qualification plans for requirements verification and risk reduction utilizing a combination of engineering analysis and environmental testing (Thermomechanical, Shock/vibe, humidity, other fatigue tests, and overstress testing).
-Ability to obtain and maintain a TS/SCI clearance
-Bachelors, Masters, or Ph.D. in mechanical engineering, aerospace engineering, electrical engineering, physics, math, or a related discipline
-Minimum 3 years experience in spacecraft payload or spacecraft development
-Familiarity with design-for-manufacturing and qualification for space systems
-Must have good interpersonal and team-oriented skills
-Excellent verbal and written communication skills
-5+ years experience in electronics packaging for spacecraft payloads or spacecraft
-Experience performing mechanical analysis including structural, thermal, and vibration
-Experience with passive or active electronically scanned arrays.
-Experience with radar, SIGINT, and/or communications systems.
-Experience with moderate to high volume space system production.
-Experience with multi-chip modules and/or MMICs.
-SOLIDWORKS 3D Computer-Aided-Design (CAD) and PDM experience
-The ability to select appropriate materials for interfaces and interconnects in electronic packages such as die attach, die encapsulation material, thermal interface materials, solder types, connectors, and adhesive attachment for components.
Posting ID: 550889201Posted: 2020-07-23