Principal Mixed-Signal Electronic Design Engineer

Principal Mixed-Signal Electronic Design Engineer Direct Hire, FTE Full Benefits Security Requirement: Applicants selected for this position will be required to obtain and maintain a U.S. Security Clearance. A primary requirement for a security clearance is US citizenship. We are seeking a Principal Mixed Signal Electrical Engineer to join the Low Power Electronics group. As a principal member of the technical staff, the candidate will play a critical role in the development of next generation sensor/actuator hardware within the Electronics Division. Members of the Embedded Electronics group support a variety of multi-disciplinary programs lasting an average of 12 to 18 months each. In addition to working on sponsored programs, group members are also encouraged to develop and participate in internally funded research and development programs. he ideal candidate is someone who works well in cross-functional teams and has extensive experience interfacing with sensors/actuators and wireless systems with low size, weight, and power requirements. Core Responsibilities: System architecture design and trade studies Proposal development and project execution Detailed electrical analysis and design for mixed-signal electronics Schematic capture, simulation, and PCB layout/oversight Prototype bring up and debugging Functional verification Performance characterization Required Qualifications: MS in Electrical Engineering (PhD preferred) 15+ years of work experience in mixed-signal electronic design Outstanding technical capability with strong electrical engineering fundamentals Experience leading teams of engineers as well as a background in developing new products/business Excellent written and oral communication Additional Desired Qualifications: Experience in all of the following areas of electronic design: miniature low power embedded systems, sensor integration, wireless communication interfaces, battery conditioning and maintenance. Basic experience with microcontroller software (using C/C++/or assembly), and FPGA firmware (VHDL or Verilog). Ability to develop code for bring-up tests or simple demos. Familiarity with signal and power integrity analysis tools (Hyperlinx, Ansys) Experience with miniature electronic packaging and design using bare die or chip-scale packages. Ability to understand and influence packaging design constraints and requirements for custom designs.