BGA Inspection & Repair Operator

This position will report to the Production Supervisor and is responsible for reworking and/or repairing nonconforming product and ensuring product standards.

A Ball Grid Array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.

Employee will be using various types of equipment for rework such as soldering irons, hot air pencils, hot air machines, electroplating devices, etc. They will also be responsible for utilizing various types of inspection equipment (such as microscopes, ring lights, hand loupes, etc.) and performing various delicate operations that may include pad/trace repair, solder mask repair, finger repair and component removal/replacement. Other duties will include labeling products appropriately, preparing product and related quality system documentation for movement of materials to designated areas, completing production paperwork, maintaining associated records and documentation according to the ISO Quality System, working with the Quality Department as well as Production, etc.

Qualification Requirements will include:

• High Level 2 or Level 3 Solder Certification, X-Ray training, BGA removal and replacement training.
• Basic Microsoft Office skills required.
• High School Diploma or GED Equivalent
• 1-5 years of previous BGA Repair experience in electric or mechanical manufacturing environment required.

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Physical: While performing the duties of this job, the employee is regularly required to perform physical activities that require considerable use of arms, legs, and whole body movement. The employee must walk and stand for extended periods of time, lift up to 35 pounds without assistance on a repetitive basis and lift materials greater than 35 pounds with assistance. Manual dexterity with hands and fingers is necessary to make quick, precisely coordinated movements to grasp, manipulate, and assemble very small objects on a consistent basis. Must be able to frequently extend or reach with hands and arms while performing routine job functions including: scanners, hand tools, power tools, and production equipment. The job will require occasional climbing, balancing, stooping, kneeling, and crouching.

Sensory: The job will require the employee to possess the ability to see and interpret instructions, warnings, safety hazards, colors, and procedures, the ability to hear alarms and pages, to listen for safety hazards, to listen to and understand information and ideas presented through spoken words and sentences in English, and the ability to communicate with peers through spoken words in English to complete job requirements.

Environmental: Employees may be exposed to solder fumes. Eye protection, respirators, and safety clothing will be required and supplied by the company in instances where there is exposure to safety hazards.

Reasoning: While performing the duties of this job, the employee is regularly required to read, understand, and interpret written sentences, paragraphs, and instructions in English for work related documents. This position requires the ability to apply common sense understanding to carry out instructions furnished in written, oral, or diagram form. The employee is regularly required to use critical reasoning to make rational decisions. The employee is regularly required to perform basic mathematical problems for work related functions.

Key Responsibilities

• Perform BGA repair.
• Perform repair of printed circuit board assemblies.
• Hand solder components per specifications.
• Operate equipment such as Desolder, Hot Air Pencil etc.
• Assist, as required, with the operations in other areas.
• Uses Microscope to verify part placement, and orientation.
• Manually align parts before soldering, perform post re-flow inspection, and touch-up.
• Maintains general cleanliness of the SMT Production area and equipment.
• Perform other assignments as required.

Desired Qualifications/Characteristics:

• Must be able to read documentation/drawings.
• Must be able to perform and have knowledge of SMT processes.
• Must be able to work without close supervision.
• HS Diploma or GED Equivalent.
• Must be able to lift and move up to 35 lbs.
• Experience handling electronic components and assemblies.
• Quality conscious and detail oriented.
• Demonstrated organization skills.
• Demonstrated ability to follow procedures.
• Demonstrated good communication skills.
• Able to work without close Supervision.
• Willing to learn and be a team player.

MUST PASS SOLDER EVALUATION:

Solder candidates are for SLB Down Hole, the most difficult hand solder on the Flex Austin site. All candidates must have:

- Strong solder II skills

o Install Pin Thru Hole components

o Solder with different gauges of insulated wires

o Install Wires in Thru Hole

o Install fine pitch components

o Install integrated circuits

o Install wires to leadless

About Aerotek:

Our people are everything. As a Best of Staffing® Client and Talent leader, Aerotek® Inc. has distinguished itself as a leader in recruiting and staffing services, by having a deep understanding of the intersection of talent and business. As a strategic partner to more than 17,000 clients and 300,000 contract employees every year, Aerotek's people-focused approach yields competitive advantages for its clients and rewarding careers for its contract employees. Headquartered in Hanover, Md., Aerotek operates a network of over 230 non-franchised offices with more than 6,000 internal employees dedicated to serving our customers. Aerotek is an operating company of Allegis Group, a global talent solutions provider. To learn more, visit .

Aerotek is acting as an Employment Agency in relation to this vacancy.