SOC Thermal Engineer

**Role Number:** 200626309-3760 **Summary** Do you love working on challenges that no one has yet solved? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device’s thermal performance and participate in advanced IC packaging research and development. **Description** The Thermal Engineer will design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines. **Minimum Qualifications** + BS + 10 years of industry experience. **Preferred Qualifications** + MSEE +10 years of industry experience. + Demonstrated leadership capabilities at the senior engineer level. + Deep expertise in thermal design for silicon devices and packaging solutions. + Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies. + Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches. + Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics. + Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs. + Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products + Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk. + Experience designing and executing experimental test setups and analyzing thermal data.