Electronic Assembly Standards and Capital Equipment Engineer

Join a team that sets the bar for electronic assembly at Rockwell Automation

We’re seeking an experienced engineering professional to drive global process standards and technology execution for electronic assembly (PCBA). You’ll report to the Manager of Manufacturing Process Engineering – PCBA and work closely with our Mequon and New Berlin facilities while influencing sites around the world.

Why this role matters

• Advance quality, reliability, and throughput through global standardization.
• Own the technology roadmap: evaluate, justify, and implement next‑gen equipment.
• Apply advanced analytics and Lean Six Sigma to continuous improvement.
• Embed DFM/DFA principles to accelerate robust product launches.

Where you’ll focus

• Process expertise: Build and sustain deep capability in at least two of the following: Wave soldering, Selective soldering, Conformal coating, PCB panel singulation, SMT solder printing, SMT pick‑and‑place, SMT reflow, AOI, equipment maintenance & troubleshooting.
• Standards & governance: Develop global process standards; publish procedures, work instructions, and training; ensure best‑practice conformance across facilities.
• Capital programs: Lead equipment selection, cost/benefit justification, purchasing, installation, and production release; benchmark emerging solutions; assess plants using common criteria.
• Analytics & CI: Design and run DOE; use control charts and statistical analysis; report KPIs; drive DMAIC/DMADV projects.
• Cross‑functional influence: Partner with design for DFM/DFA; integrate assembly needs into Electronic Assembly Design Guidelines; share expertise via presentations and technical reviews.

Must‑have qualifications

• Bachelor's degree in a relevant field.
• Ability to spend significant time on‑site in Mequon and New Berlin.
• Legal requirement: Legal authorization to work in the U.S. We will not sponsor individuals for employment visas, now or in the future, for this job opening

Preferred background

• Typically 8 years of experience.
• BS or MS in Mechanical, Electrical, or Industrial Engineering.
• 7–10+ years in hands‑on electronic assembly manufacturing.
• Proficiency in solder profiling, SMT, post‑SMT, or conformal coat.
• Working knowledge of IPC‑A‑610.
• Lean Six Sigma (Green Belt+ preferred).

Technical fluency

• Bachelor's Degree
• 5 Why (Root Cause Analysis Method)
• ISO 22000
• Process Engineering
• Design for Assembly (DFA)
• Electrical / Electronic Systems
• Engineering Degree
• AS9100 Experience

About the team

You’ll join a specialized group at the nexus of manufacturing excellence, technology roadmap ownership, process standardization, and advanced process analysis. The team’s charter: deliver measurable results in quality, reliability, throughput, and long‑term profitability for global electronic assembly operations.